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Electrode (Cathode research)

The RPL’s effort to improve the cathode of low temperature SOFCs has two thrusts: first, sputtering of platinum and Pt alloys, and second, using Pulsed Laser Deposition (PLD) and Atomic Layer Deposition (ALD) to make thin-film mixed electronic-ionic conducting (MEIC) cathodes.

We developed a sputtering technique to deposit porous metals to develop nanostructured films that are continuous to provide a path to conduct electrons, and have Triple-Phase Boundary (TPB) to maximize the density of reaction sites. Our Pt cathodes perform better than expected, but we still want to improve their performance and develop lower-cost materials. We use co-sputtering to test Pt alloys for catalytic activity and stability. We also use quantum simulations to predict stability and activity of the compounds we test experimentally.

To expand the TPB, it is common to use a MEIC so that the entire electrolyte/electrode interface is conductive. We are testing the MEICs (La_xSr_1-x)(Co_yFe_1-y)O₃ (LSCF) and (La_xSr_1-x)MnO₃ (LSM) and fabricating them via PLD and ALD. PLD and ALD are commonly used in semiconductor manufacturing to produce thin films. PLD is a physical vapor deposition technique where a target material is ablated by a laser, and the vaporized particles land on the substrate. ALD is a chemical vapor deposition technique where precursors are pulsed into a chamber and react to form a monolayer on the substrate. A second pulse of oxidant deposits oxygen, and this series is repeated to build up a film. ALD is known for its ability to produce uniform, conformal films with precise control of thickness.